Automotive Electronics PCBA Manufacture
Automotive electronics
1. Car inverter, car charger, car air purifier, car vacuum cleaner, etc
2. Car dashboard, car central control large screen (navigation function), car electronic modification, car audio
HLC Process capability
| Item | HLC Advanced Technology |
| 2019 | 2020 | 2021 |
| Max Panel Width (inch) | 25 | 25 | 25 |
| Max Panel Length (inch) | 29 | 29 | 29 |
| Max Layer Count (L) | 16 | 18 | 36 |
| Max Board thickness (mm) | 3.2 | 4 | 6 |
| Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% |
| Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
| Outer Layer ( OZ ) | 2 | 3 | 4 |
| Min DHS ( mm ) | 0.2 | 0.15 | 0.15 |
| PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 |
| Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 |
| Max. AR | 12:1 | 16:1 | 20:1 |
| Item | HLC Advanced Technology |
| 2019 | 2020 | 2021 |
| M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 |
| Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 |
| Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
| <50ohms | 5 Ω | 5 Ω | 4 Ω |
| Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 |
| Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 |
| Max dimple for POFV ( um ) | 30 | 20 | 15 |
| Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au |
HDI Process capability
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Structure | 5+n+5 | 6+n+6 | 7+n+7 |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 |
| Min. 12L | 0.65 | 0.6 | 0.55 |
| MAX. | | 2.4 | |
| Min. Core Thickness ( um ) | 50 | 40 | 40 |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 |
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 |
| Min BGA Pitch (mm) | | 0.35 | 0.3 | 0.3 |
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG |
SMT Capability
| Item | SMT Capability |
| 2019 | 2020 | 2021 |
| Min board thickness ( mm ) | 0.1 | 0.06 | 0.05 |
| Max. board size ( mm ) | 200 x 250 | 250 x 300 | 250 x 350 |
| Chip component ( L, C, R etc. ) | Minimum size | 1005 | 1005 | 1005 |
| Connector | 0.5 mm pitch | Y | Y | Y |
| 0.4 mm pitch | Y | Y | Y |
| 0.35 mm pitch | Y | Y | Y |
| High density component : | 0.5 mm pitch | Y | Y | Y |
| TSOP, QFP, QFN, LGA, BGA etc. | 0.4 mm pitch | Y | Y | Y |
| | 0.35 mm pitch | Y | Y | Y |
| Reflow | N2 reflow | No | Y | Y |
| Under-fill | Fill under chip | Manual | Auto | Auto |
| ACF attach | Gold finger pitch | N/A | 0.3 mm | 0.2 mm |
| Inspection | Component position, direction, missing etc. | Manual check with 10 x scope | Auto AOI inspection | Auto AOI inspection |
| Solder paste thickness | Measure once per shift | 1 line auto full area, online SPI | All lines auto full area, online SPI |
| Packaging & Delivery |
| Packaging Details: | Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement. |
| Port: | Shenzhen or Hongkong |
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| | Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
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